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Wafer processing service

Wafer processing service

We create new value in semiconductor wafer services such as film formation processing and regeneration processing!

At AITES Co., Ltd., we assist our customers in solving various challenges related to bare wafers and their processing. In response to the increasingly diverse semiconductor needs, we provide expertise and excellent responsiveness in the areas of wafer, film deposition processing, and reclaim processing in the front-end field. Additionally, we have started accepting orders for MEMS prototype processing using silicon and fine electroforming. 【Service Offerings (Partial)】 ■ Wafer film deposition processing ■ Wafer patterning processing ■ Wafer reclaim processing ■ Sales of bare wafers *For more details, please refer to the PDF materials or feel free to contact us.

  • Prototype Services
  • Ceramics

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Wafer processing service

Wafer processing service

Aites wafer processing service that supports the birth of new technologies.

Aites' wafer business division offers professional wafer processing services that widely cater to a diverse range of test wafer needs. Aites boasts a dedicated 8-inch processing line as its flagship, providing services in the wafer processing field for over 12 years. We utilize our accumulated technical know-how and unique processing resources to comprehensively address processing requirements ranging from 2 inches to 12 inches. A notable feature of Aites' wafer services is the high number of repeat customers, as we gain strong trust from our clients by supporting wafer processing projects quickly and broadly.

  • Ceramics

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IC wafer processing service

IC wafer processing service

Wafer processing contract service

- Back grinding processing - Laser grooving / dicing processing with blades - Rib cutting of TAIKO*1 wafers - We can also handle bare die shipping and package assembly. - You can also choose the shipping method. (Tray, dicing tape, embossed tape (reel) packaging, etc.) If you have any concerns, please feel free to contact us. *1 TAIKO is a registered trademark of Disco Corporation. TAIKO Process The "TAIKO Process" is a technology that differs from conventional back grinding. When grinding the wafer, it leaves the edge portion of the outer circumference (about 3 mm) intact and only grinds the inner circumference to reduce thickness. The introduction of this technology reduces the transport risk of thin wafers and minimizes warping. (Refer to https://www.disco.co.jp/jp/solution/library/grinder/taiko_process.html)

  • Wafer

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